● Increases the speed and accuracy for placing microchips (03015) Applies dual-lane PCB transfer system (productivity increases by 15% compared to a single lane)
High Reliability
Adopts a Linear Motor to Realize Low Noise and Vibration
● Applies the twin servo control and linear motor to the Y-axis to realize low noise and vibration.
Flexible Production
Supporting Modular Conveyor System for Various Production Environments
● Possible to produce various models depending on the Modular Conveyor System replaceable on site.
Easy Operation
Reinforces the Convenience of Machine Software Operation
● The built-in optimization software allows a PCB program to be easily created and edited.
Advanced Chip Shooter Decan S2 Features
● Secures the applicability to components and conveyor flexibility.
● Reduces production time by optimizing the motion sequence.
● Reinforces odd-shape component recognition by applying 3D lighting system.
Advanced Chip Shooter Decan S2 Specification:
Model
Decan S2
Alignment:
Fly Camera + Fix Camera (Option)
The Number of Spindles:
10 Spindle x 2 Gantry
Placement Speed
(Optimum):
92,000 CPH (Optimum)
Placement
Accuracy:
Chip
±28 μm @ Cpk ≥ 1.0 (03015 Chip)
IC
±30 μm @ Cpk ≥ 1.0
Component
Range:
Fly Camera
03015 ~ □12 mm
Fix Camera
~ L75 mm Connector (MFOV)
Max. Height
10 mm (Fly) 15 mm (Fix)
PCB Size (mm):
Min.
L50 x W40
Max.
Single Lane
~ L510 x W460 (Standard)
~ L1,200 x W460 (Option)
~ L1,500 x W460 (Option)
Dual Lane
~ L510 x W250 (Standard)
~ L510 x W280 (Option)
~ L1,200 x W250 (Option)
PCB Thickness (mm):
0.38 ~ 4.2
Feeder Capacity
(8 mm Standard):
120 ea / 112 ea (Docking Cart)
Utility:
power
3 Phase, AC 200 / 208 / 220 / 240 / 380 / 415V ±10% (50/60 Hz)
Max. 5.0 kVA
Max. 5.0 kVA
Air
Consumption
5.0 ~ 7.0 kgf/cm2
50 Nℓ/min
Weight (kg):
Approx. 1,800
External Dimension (mm):
L1,430 x D1,740 x H1,485
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