Full Automatic Solder Paste Printing Machine GTS

The GTS automatic tin paste printing press is a high-end model for SMT high-end application, The width of GTS-BTB is only 2570 mm, which can satisfy the printing process requirements of 03015, 0.25 pitch, high precision and high speed.

Available Options

	CCD digital camera system ● Total new optical path system, uniform circular light and high brightness of coaxial light source. With both light source system, brightness can adjust to an infinite loop, allowing different mark point can be easily recognize (including uneven mark point) such as tin plating, copper plating, silver plating, hot air soldering, FPC and various types of different PCB color.

	High precision adjustable PCB thickness lift up platform ● Advance design, compact structure, high reliability, Smooth and stable lift up/down platform, pin height automatically adjust by software control. Precisely realize different types of PCB thickness position height adjust.

	Guide Rail positioning System ● New pattern patented guide rail can detachable, programmable flexible side clamp, specific to FPC, PCB warpage, perform a unique clamping plate device. Through software programming can automatically stretch out and draw back unaffected PCB thickness.

	Total new squeegee blade structure design ● Through sliding rail and air cylinder new pattern squeegee blade structure, increase movement stability and prolonging the service life.

	High speed cleaning system ● Drops of rain washing structure, effectively prevent the solvent tube blockage cause no solvent while cleaning and poor cleaning effect.

	New mult-function interface ● Simplicity, Clearly understand, friendly user. ● Actual temperature and humidity monitor function.

	Stencil check System ● Through light source compensation at stencil and CCD real time inspection check on stencil holes which can rapidly detect, judge stencil after cleaning whether stencil holes is been block and auto clean. Is complement for PCB 2D inspection.

	Automatic Dispensing System ● In view of the different printing requirement, dispensing through glue, solderpaste, dispense line, padding etc can be performed after the printing process. Dispensing head is equip with heating function to maintain glue viscosity with better flowability.

	Cylindricil type automatic add solder and solder paste iispection function ● Mobile automatic add solder paste to ensure the quality of solder paste and the amount of solder paste in steel mesh. To ensure the quality and productivity of customers. ● precision sensor to manage amount of solder paste at stencil, be able to extend and continuous printing thus increase productivity

	SPI Onlint ● With SPI close loop connection, when received SPI feedback on poor printing information, machine will automatic adjust per SPI data and correct. XY shifted auto adjust complete by within 3 pieces and clean stencil. This will improve printing quality and production efficiency. It form a complete printing feedback system.

	4.0 the compatibility ofleading industry ● Through to the machine status, parameters can be automatically upload or output support customer Industrial 4.0 intelligence production much more guarantee. With industrial 4.0 it can seamless connection and realized with customer MES system, product traceability, intelligence control machine maintenance. Distribution according to the on-site management implementation engineers at the level of access.

	BTB ● BTB provides greater flexibility for the user production line configuration, and now you can use GTS BToB's excellent print performance to get dual channel output in less total area.

Full Automatic Solder Paste Printing Machine GTS Specification:
Model	GTS
Machine Performance
Repeat Position Accuracy:	±10um@6o, CPK>2.0
PrintAccuracy:	±18um@6o, CPK>2.0
NCP-CT:	<7.5 sec
HCP-CT:	18s/pcs
Process CT:	4min
Change over CT:	2min
Substrate processing parameter
Maximum board size:	450*310mm
Minimum board size:	50*50mm
Board thickness:	0.4~6mm
Camera Mechanical range:	450*310mm
Maximum board weight:	3kg
Board edge clearance:	2.5mm
Board height:	15mm
Transport speed:	900 ± 40mm
(Max) Transport speed:	Segmented control, 1500mm/s (Max)
Transport direction:	One stage
Transmission direction:	Left to right
	Right to Left
	In and out the same
Support System:	(65mm)Magnetic Pin
	(65mm)Support Block
	Patented over the top clamping
Board clamp:	Automatic top clamping
	Side clamping
	Adsorption function
Printing Parameters
Print Speed:	10~200mm/sec
Print Pressure:	0.5~20Kg
Print Mode:	One/Twice
Queegee Type:	Rubber/Squeegee Blade (angle 45/55/60)
Snap-off:	0-20mm
Snap-Speed:	0-20mm/sec
The template frame size:	470370mm~737737mm (thickness：20-40mm)
Steel mesh positioning mode:	Automatic Y orientation
Cleaning Parameters
Cleaning System:	Dry, Wet Vacuum three modes
High speed cleaning:	Integrated & weave cleaning
Cleaning system:	Side spray type
Cleaning stroke:	Automatic generation
Cleaning position:	Post cleaning
Cleaning Speed:	10-200mm/sec
Cleaning fluid consumption:	Auto & Manually adjustable
Cleaning paper consumption:	Auto & Manually adjustable
Vision Parameters
CCD FOV:	10*8mm
Camera type:	130 Thousand CCD Digital camera
Camera System:	Lock up/down optics structure
Camera Cycle time:	100ms
Fiducial mark types:	Standard Fiducial Mark Shape
	round、square、diamonds cross
	Pad and profile
Mark size:	0.1-6mm
Mark number:	Max: 4pcs
Stay away number:	Max: Ipcs
Machine parameter
Power Source:	AC:220 ±10%, 50/60HZ 2.2KW
Air Pressure:	4-6Kgf/cm2
Air Consumption:	5L/min
Operating Temperature:	-20℃~+45℃
Working environment humidity:	30%~60%
Machine dimension (without Tower light):	1530(H) mm
Machine Length:	1150(L) mm
Machine Width:	1280(W) mm
Machine Weight Approx:	Approx: 1000Kg
Equipment load bearing requirements:	650Kg/㎡