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X-Ray machine SoYi-R9

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The system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.

X-ray absorption differences by different materials, the internal structure of objects imaging and detection of internal defects, can be real-time observed products inspection image, determine whether the internal defects and defect types and grades, at the same time through the computer image processing system to complete the image storage and processing, in order to improve the image resolution, Ensure the accuracy of the assessment.

SoYi-R9 can achieve inspeciton accuracy of 1um, can be used to detect integrated circuit chip semiconductor, such as BGA, IGBT, inverted chip and PCBA component welding, LED state, IC packaging and other industries of high precision testing.

Available Options


X-Ray detecting theory

X-Ray detecting theory

●   X-Ray tube and flat panel detector can tilt 60 degree for inspection.

Common defect-Electronic semiconductor

BGA soldering quality

BGA soldering quality

insufficient solder, bubble on lead

insufficient solder, bubble on lead

IC golden wire \ bubble detecting

IC golden wire \ bubble detecting

Solder height

Solder height

Soldering point bubble measuring

Soldering point bubble measuring

BGA bubble measuring

BGA bubble measuring

PCBA detecting

PCBA detecting

5G Base station circuit board detecting

5G Base station circuit board detecting

LED bubble detecting

LED bubble detecting

Chip bubble detecting

Chip bubble detecting

Chip bubble detecting

Chip bubble detecting

Common defect-Electronic semiconductor
Common defect-Electronic semiconductor
DIP soldering height detecting

DIP soldering height detecting

Component detecting

Component detecting

Common defect-Electronic semiconductor

SoYi-R9 X-RAY machine Advantage

1, CNC programming, automatically inspect multiple position.

2, Automatically inspect multiple components on same position.

3, High end X-ray source with flat panel makes inspection accuracy can reach 1um.

4, One key to measure void size and percentage.

5, X-Y movement  controlled by joystick.

6, X-Ray source can tilt 60 degree to inspect components.

7, Big loading platform, easy to inspect big product.

8, Wide application shown as right picture.

Advantage

SoYi-R9 Specification

Hardware

  X-Ray Source

  Type   Enclosed
  Volatge   100kV(200uA)
  Brand     CANON, made in Japan
  Spatial resolution   1um
  Imaging unit   Type   Flat panel detector
  Tilt angle   Single side 60°
  Pixel matrix   1648*1644 pixel
  Pixel size   76um
  Frame rate   30ps
  System magnification   450X
  Brand   DRTECH

  Computer

  Industrial PC   Industrial PC, Window 10 system
  Display   23”

  Loading platform

  Loading area   690mm×685mm
  Detecting area (max)   670mm×665mm

  Software

  Software   Self-developed image processing system
  Auto measuring   BGA soldering voids auto measuring, support data /graphic output
  Multi measuring tools   Support measuring distance, angle, diameter, polygon, PTH filling rate, etc
  Real time display   Real time diplaying the working data of voltage, current, angle, date, etc.
  CNC programming   CNC programming to detect mutiple position autimatically

  Gerneral

  Power   2kW
  Size   1510*1770*1850mm(L*W*H), not including display and lighting tower
  Weight   1800KG

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