The system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.
X-ray absorption differences by different materials, the internal structure of objects imaging and detection of internal defects, can be real-time observed products inspection image, determine whether the internal defects and defect types and grades, at the same time through the computer image processing system to complete the image storage and processing, in order to improve the image resolution, Ensure the accuracy of the assessment.
SoYi-R9 can achieve inspeciton accuracy of 1um, can be used to detect integrated circuit chip semiconductor, such as BGA, IGBT, inverted chip and PCBA component welding, LED state, IC packaging and other industries of high precision testing.
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