BA-400/BA-550 is a bottom type AOI equipment for throughhole solder joint inspection and chip component inspection. BA-400/BA-550 uses intelligent algorithm which can just click one button for programming, it greatly reduce the programming and debugging work, AI deep learning and self-training function can extend detectable defect types to reduce the misjudgement rate.
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THT Solder Joint Automated Inspection System Dimension : |
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Dimension of the machine : |
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THT Solder Joint Automated Inspection System Hardware: |
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High stability granite platform ensure machine running fast and stably. |
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X/Y servo motor with high precision ball screw driving system ensures running accuracy. |
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Equipped with 5M pixels CCD with RGB 3 color light source to ensure inspection accuracy. |
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Heavy roller chain conveying system which can bear the weight of fixture. |
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The top of the RGB 3 color light source is equipped with a air blow-type cleaning device, which can effectively clean the foreign matter such as tin dross on the top of the RGB 3 color light source. Keep the CCD and RGB 3 color light source clean. |
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THT Solder Joint Automated Inspection System Algorithm: |
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Intelligent neural network algorithm: The traditional algorithm is mainly to compare the color of the reflected light of the soldering joint, and then to judge whether it has bad quality. In this case, the programmer is required to be experienced and familiar with the various forms of bad products. Neural network algorithm through the analysis of big data processing, can know the various forms of solder joints,and low requirements for the operator. |
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THT Solder Joint Automated Inspection System Algorithm: |
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Intelligent algorithm also can train the components with large sample images to comprehensively recognize the features of the components to improve the misjudge problems. |
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Priciple comparision with raditional algorithm |
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THT Solder Joint Automated Inspection System Programming: |
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Easy programming: Use Intelligent algorithm which can automatically search chip components and solder joint on the PCB image without CAD files, and give the parameters, operator only need to fine-tune the program, it makes programming very easy. |
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THT Solder Joint Automated Inspection System Software function: |
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Path optimization: Fewer FOVs : Do not photograph on where there is no solder joints to reduce FOVs and make inspection more efficient. Shorter photographing paths to save time More suitable imaging position : avoid solder joint at FOV junction to ensure test effect. |
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THT Solder Joint Automated Inspection System Software function: |
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Multiple detection and debugging modes: ◆ Support panel board detection. ◆ Support mixed board detection, suitable for small-batch multi-PCB detection. ◆ Badmark skip mode. ◆ Online programming and debugging without stopping the production line. ◆ Offline programming (optional ). |
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THT Solder Joint Automated Inspection System Data statistic: |
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Powerful data statistic software, easy to search and to be exported as a Exel file. |
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THT Solder Joint Automated Inspection System Features: |
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● High stability granite platform ensure machine running fast and stably. |
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● X/Y servo motor with high precision ball screw driving system ensures running accuracy. |
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● Heavy roller chain conveying system which can bear the weight of fixture. |
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● Equipped with 5M pixels CCD with RGB 3 color light source to ensure inspection accuracy. |
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● Detection items: Chip components: Wrong, Miss, Reversed, Skew, Redundant, shift, foreign matter. Solder joint: excess, insufficient, no foot, bridge, not wetting. |
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● Easy programming: Use Intelligent algorithm which can automatically search chip components and solder joint on the PCB image without CAD files, and give the parameters, operator only need to fine-tune the program, it makes programming very easy. |
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● Intelligent algorithm: Intelligent neural network algorithm which can train the components with large sample images to comprehensively recognize the features of the components to improve the misjudge problems, and make programming easy. |
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● Equipped with Data statistics software, easy to search and export detailed statistical data. |
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● Capable to connect with MES(option). |
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THT Solder Joint Automated Inspection System Specifications |
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| Model | BA-400 | BA-550 | |
| Image System | Camera | 5Mpixels CMOS Camera | 5Mpixels CMOS Camera |
| Resolution | 15µm | 15µm | |
| FOV size | 36*30mm | 36*30mm | |
| Lighting | 3 color ring shape LED（RGB） | 3 color ring shape LED（RGB） | |
| Motion System | X/Y Movement | AC Servo motor | AC Servo motor |
| Platform | Granite, ball screw and linear rail. | Granite, ball screw and linear rail. | |
| With adjustment | Auto/Manual | Auto/Manual | |
| Flow Direction | L→R | L→R | |
| Hardware | PC configuration | Intel I5 CPU, 32G DDR , 256G SSD +2T hard disk | Intel I5 CPU, 32G DDR , 256G SSD +2T hard disk |
| Communication | SMEMA | SMEMA | |
| Power Supply | 1ph 220V，50/60Hz , 1KW | 1ph 220V，50/60Hz , 1KW | |
| Air Supply | 0.4-0.6Mpa | 0.4-0.6Mpa | |
| Machine Size | L1100*D1220*H1350mm(not including display and light tower) | L1100*D1420*H1350mm(not including display and light tower) | |
| Weight | 800kg | 890kg | |
| Software | Operation System | Ubuntu 14.04 LTD 64bit | Ubuntu 14.04 LTD 64bit |
| Programming | Online programming, offline programming, Gerber file loading, one-key programming with image | Online programming, offline programming, Gerber file loading, one-key programming with image | |
| Statistic data function | SPC software | SPC software | |
| PCB Size | Size |
3 section rail : 50*50-350*400mm 1 section rail : 50*50-450*400mm |
Single-section rail : 50*50-550*550mm, can detect max 710*550 board with 2 section inspection |
| Thickness | 0.5-6.0mm | 0.5-6.0mm | |
| PCB Weight | 3kg | 3kg | |
| Clearance | Top/Bottom：110/25mm | Top/Bottom：110/25mm | |
| Clamping Edge | 5.0mm | 5.0mm | |
| Inspection Catagories | Component | Missing, Reversed, Shift, Damaged, Skew, Redundant, Foreign material | Missing, Reversed, Shift, Damaged, Skew, Redundant, Foreign material |
| Solderjoint | No solder, Insufficient/Extra solder, Bridge, not welding, no foot, Hole | No solder, Insufficient/Extra solder, Bridge, not welding, no foot, Hole | |
| Inspection Component | Chip:03015 and above LSI:0.3mm pitch and above | Chip:03015 and above LSI:0.3mm pitch and above | |
| Inspection Speed | 230-250ms/FOV | 230-250ms/FOV | |
| Barcode reader | 1D or 2D barcode reading by camera | 1D or 2D barcode reading by camera | |
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HT Solder Joint Automated Inspection System Includes: |
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Standard configuration: |
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1.THT Solder Joint Automated Inspection System BA-400/BA-550. |
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2.Online programming software (combined with AOI software ). |
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3.Data statistic software(combined with AOI software). |
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Option configuration : |
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1.Offline programming software. |
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