Pro-650 is the most popular BGA rework station with touchscreen control, 3 individual zone, 6 bottom heater with height adjustable, programmable up/bottom heating, 50X high resolution camera system, 3 thermcouple for real-time profiling.
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Easily-adjusted PCB positioning bracket PCB positioning is realized by V-shaped slots. Flexible, simple and portable universal fixture can protect PCBs, prevent components along PCB edges from damage and PCBs from deformation, and can adapt to the rework of encapsulated BGAs with various sizes. Maximum PCB size to be held is 380mm x 380 mm and the minimum PCB size is 20mm x 20mm. |
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Independent three-zone temperature control system Pro-650’s three temperature zone are heated independently, where both upper and lower temperature zones are heated by hot air and the bottom zone is heated by infrared heater with a temperature accuracy of ±3℃. Both upper and lower heaters can control different zones’ temperatures simultaneously; the IR pre-heater at the bottom zone can heat PCBs evenly. Meanwhile, IR preheating zone’s power output can be adjusted according to actual requirements so that temperatures can be set reasonably for more safe and reliable rework. |
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Integrated design for upper temperature zone Upper heating head and mounting head are designed in an integrated way with the functions of automatic soldering and automatic mounting. Unique hot-air nozzle and mounting head’s dual-pressure sensor protection ensure that the BGA chips are not damaged by pressing. At the same time, it is equipped with various BGA hot-air nozzles which can be rotated by 360° arbitrarily, installed and replaced easily, and customized according to customer requirements. The enclosed laser alignment device can help realize fast alignment. |
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Micrometer is used to realize accurate X/Y-axis and R-angle alignment Micrometer is used to realize accurate X/Y-axis and R-angle alignment with a precision of ±0.02mm. |
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Accurate optical-alignment system High-resolution CCD optical visual alignment system is used with spectral, amplification, fine-tuning, and auto-focus functions and also equipped with automatic chromatism discrimination and brightness adjuster. Imaging resolution can be adjusted manually and displayed by 15” high-definition LCD, thus ensuring a simple, fast and accurate alignment between BGA chips and PCB pads with an alignment accuracy within 0.01-0.02 mm. |
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K-type closed-loop thermo-couple controller High-precision K-type thermocouple is used as closed-loop controller with three external temperature interfaces to realize precise temperature measurement.After BGA de-soldering is finished, voice alarm will be triggered. If temperature gets out of control, power can be cut off automatically. Dual over-heat protectors are also available. |
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Cooling and exhausting systems High-power cross-current fan can cool PCBs rapidly, thus preventing PCBs from deformation and ensuring higher soldering quality. Exhausting system is included to prevent harmful gas from diffusion. |
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Multi-function humanized operating system HD touch-screen man-machine interface and PLC controller are used. Three temperature curves can be shown simultaneously. The default temperature curves can be selected randomly or this interface may be used to modify and create the temperature curves. Temperatures can be precisely controlled within ±1 degree. De-soldering, mounting, or soldering mode can be selected and intelligent automation is also possible. |
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Self-defined temperature curve unit 6 zones’ temperatures are controlled. Excellent temperature controlling system can guarantee better soldering effect. It can store 1-100 groups of temperature curves. You may perform curve analysis or change the settings simultaneously on touch screen. |
PRO-650 Rework Station Feature
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● Adopted with Linear slider, all the three axles (X, Y, and Z) can do fine tuning and quick orientation with perfect positioning accuracy and speedily maneuverability.
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● Equipped with touch panel interface and PLC controlling to ensure it work stably and reliably. And it can storage multiple temperature profiling data of users. With password protection and modification function while power on. The temperature profiles will be displayed on the touch screen.
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● Three temperature zones to heat up independently, hot air heat up between up and down zones, IR heat in the bottom, temperature precise control is in±2℃.the up heating head can remove the BGA chips automatic; the second zone can be adjusted up and down. The top and bottom heaters can be set several segments control at the same time. IR heating zone can be adjusted output power in the light of operation requirements.
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● The hot air nozzle can be rotated in 360 degree, the IR heater in the bottom can heat up the PCB board uniformly.
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● High accuracy K-type thermocouple closed-loop controlling. It can test temperature accurately through external temperature measurement interface, PCB board positioned by closed V-shape slot. The flexible and convenient universal jigs can prevent any damage or PCB deformation as well as it is suitable for all size of BGA package.
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● Large power fan to cool down the PCB quickly. The built-in vacuum pump and external vacuum nozzle is able to take BGA chips out automatical.
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● Having alarm prompt function after welding is done, specially added early warning function for convenient operation.
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● It has Passed CE certificate. It is equipped with emergency stop switch and protection equipment to power off automatically when abnormal accident happened. Under this situation that temperature is out of control, circuit can automatically cut off the power with double over temperature protection function. |
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PRO-650 Specification |
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PCB Specification |
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PCB Size (Minimum) |
8*8mm |
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PCB Size (Maximum Allowable) |
380*380mm |
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PCB Size (Recommended Max.) |
350*200mm |
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PCB Thickness |
0.5mm-6mm |
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Component Specification |
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Component Size |
MAX 50*50mm MIN2*2mm |
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Minimum BGA Ball pitch |
0.3mm |
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Placement Precision |
±0.03mm |
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Heating System |
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IR Bottom-heater |
380*290mm(2700W) |
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Component heater (Top) |
Hot Air 800W |
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Component heater (Bottom) |
Hot Air 1200W |
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Temperature Control |
K-Type Thermocouple; Closed Loop PID |
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Machine Specification |
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Main Power Source |
Single phase AC 220V 50/60Hz |
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Total Power Consumption |
4800W |
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Machine Dimensions |
L610*W670*H900mm |
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Net Weight |
68KG |
PRO-650 Rework Station Include
1 PC. RRO-650 BGA Rework station with:
◎ High-definition optical alignment system(50X)
◎ Auto Z-axis motion and dual-pressure sensor
◎ Micrometer adjustment for X/Y-axis and R-angle(Calibrated)
◎ 6-Zone IR Bottom heater with height adjustable
◎ 3 Thermocouple inputs
◎ Laser alignment device can help realize fast alignment
◎ 2 adjustable PCB bottom-side support beams
◎ 4 adjustable PCB bottom-side support Pins
◎ Touch Screen + PLC+ High precision intelligent control module
◎ LED Light
◎ 15“ LCD Display
Free Parts:
◎ 1 PC.50*50mm Bottom Nozzle
◎ 1 PC.19*19mmTop Nozzle
◎ 1 PC.25*25mmTop Nozzle
◎ 1 PC.31*31mmTop Nozzle
◎ 1 PC.38*38mm Top Nozzle
◎ 2 PC.K-type thermocouplels with connectors
◎ 1 PC.Top heater
◎ 1 PC.Bottom IR heater
◎ 1 PC.Brush
◎ 1 PC.4mm Vaccum Nozzle
◎ 1 PC.8mm Vaccum Nozzle
◎ 5 Pcs.silicone tips lead-free (4mm)
◎ 5 Pcs.silicone tips lead-free (8mm)
◎ 1 Set.Universal fixtures
◎ 1 set. Toolkit
◎ 1-Year Parts Warranty
Noted:Upper heater nozzles for top-side heating are available,all sized can be customized and ordered to meet your applications,
Nozzles should be approximately 2-3 mm larger than the component.
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