Flexible placer SM481 PLUS

The SM481PLUS can perform high-speed placement of chips at 40,000CPH and QFPs at one per 1.1 seconds, respectively (each at optimum speed) by applying the on-the-fly recognition technology patented by techwin, which enables component placement at the highest speed among all medium speed component placers. with one-gantry structure having a high-speed piano head with 10 nozzles, the machine can be oerated with minimum manpower using one side of the machine. Being able to produce long boards with lengths of up to1,500mm, the machine boasts of its applicability to the largest PCBs among SM series component placers.

Available Options

1,500mm long board

Two-staged placement using an extended conveyor allows production of long boards with

lengths of up to 1,500mm. (The SM482PLUS can produce boards with lengths of up to 1,200mm)

One-Side Operation

With single gantry and single lane structures optimized for machine operation using only one

side of the mchine, the production area and manpower can be utilized efficiently.

Production speed and component coverage suitable for general-purpose high-speed placement

General-purpose high-speed machine among SM series component placers, which applies a high-speed piano head with 10 nozzles and an option for an upward camera.

Panorama View Function

Since large-sized components are not viewed in one screen, it is hard to adjust their pickup or placement positions. In order to remove such inconvenience, the panorama view function is added to allow large components to be viewed within the FOV of a camera.

Component Monitoring before/after Plancement

Checks for nozzle contamination during production to prevent non-insertion and dumping of a large number of components in advance, ensuring high quality production. Time of inspection-Before/after ANC; before/after component placement; and after component dumping

Multi-Vendor Component Management Function

When the same components are supplied from different component supply devices, this function allows components to be use without changing a PCB file and downloading a new PCB file.

On-the-fly Placement Method

Owing to techwin's own On-the-fly image recognition technology which allows component recognition without stopping while moving after component pickup, placement speed is maximized by minimizing the moving time between the pickup position and placement position and reducing the recognition time to zero.

Added a new function maximizing the operational convenience of customers.

Easy Component Registration New Part Editor

A Drag & Drop component registration system, allowing registration of component informatic recognition and rotation by simply clicking the mouse. (When applying Elite2) In addition, user convenience is further reinforced by unifying the on-line/off-line comvenience is further reinforced by unifying the on-line/off-line component registration systems.

Mixed Use of Electric Feeder and Pneumatic Feeder

Mixed use of electric and pneumatic feeders in the same feeder base is available for SM series component placers. The investment in production can be minimized by using these feeders along with existing feeders.

The highest applicability to long and large PCBs among machines of the same class

Features
NO.	Performance	Parameter
1	Placement Speed	Chip 40,000CPH(Optimal)
2	Applicable Component	0402（01005inch)~ Max. 42mm（h15mm)
3	Placement Accuracy	±40μm@±3σ/Chip ±30μm@±3σ/QFP
4	Applicble PCB	L460×W400×1Lane (Standard) L1,500×W460×1Lane(Option)

SM481 PLUS Specification
Model			SM481 PLUS
Alignment			Flying Vision +Stage Vision(Option)
Number of Spindles			10 Spindes×1Gantry
Placement Speed			40,000 CPH (Optimum)
Placement Accuracy	Chip		±40μm@μ±3σ
	QFP		±30μm@μ±3σ
Component Range	Flying Vision		0402(01005)~16mm IC Connector (Lead Pitch 0.4mm) BGA, CSP(Ball Pitch 4.0mm)
			NA
	Stage Vision		~ 16mm IC, Connector(Lead Pitch 0.3mm) BGA, CSP (Ball Pitch 0.4mm)~□ 32mm IC, Connector (Lead Pitch 0.4mm) BGA, CSP (Ball Pitch 0.5mm)
			~ 32mm IC, Connector(Lead Pitch 0.4mm) BGA, CSP (Ball Pitch 0.5mm)~□ 42mm (H12mm)IC, Connector (Lead Pitch 0.5mm) BGA, CSP (Ball Pitch 1.0mm)
	Max.Height		10mm(Option 15mm)
	Min.		50(L)×40(W)
	Max.	Single Lane	460(L×400(W) 510(L)×460(W)Option 610(L)×510(W)Option Max. 1,500(L)×460(W)(Option)
		Dual Lane	NA
	PCB Thickness		0.38~4.2
Feeder Capacity (8mm standard)			120ea/112ea(Dacking Cart)
Utility	Power		AC200/208/220/240/380/415V(50/60Hz, 3Phase)
			Max3..5kVA
	Air Consumption		0.5~0.7MPa(5.0~7.0kgf/cm²)
			150Ne/min
			50Ne/min(vacuum pump)
Mass(kg)			Approx.1655
External Dimension (mm)			1650(L)×1680(D)×1530(H)