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The SM482PLUS can be applied to components from 0603 microchips to 22mm IC components by applying the on-the-fly recognition technology patented by Techwin, which enables component placement at the highest speed among all medium speed component placers. In addition, it can recognize components of 42mm with 0.4mm fine pith with a 45mm camera by applying a high pixel vision system to the stage camera. It also allows high precision (30 micron) placement of IC componets and provides a polygon recognition algorithm for easy registration of compnents of complicated shapes.
Powerful Vision Algorithm Increases the recognition accuracy using the component image noise removal function and auto-teaching function. the flying camerahelps recognize and calibrate the components including Chip, TR, BGA, QFP, etc, while moving them to the placement position after pickup. |
Automatic Real Time Pickup Position System Polygon Function Abstracts and recognizes a component wholly |
Panorama View
For components whose size exceeds the FOV of a camera, the panorama view function that combines split component images into one is used. The soluton optimized for irregular shaped SMD components is provided by teaching the pickup/placement position easyly. |
Component Monitoring before/after Plancement
Checks for nozzle contamination during production to prevent non-insertion and dumping of a large number of components in advance, ensuring high quality production. Time of inspection-Before/after ANC; before/after component placement; and after component dumping |
Multi-Vendor Component Management Function
When the same components are supplied from different component supply devices, this function allows components to be use without changing a PCB file and downloading a new PCB file. |
On-the-fly Placement Method
Owing to techwin's own On-the-fly image recognition technology which allows component recognition without stopping while moving after component pickup, placement speed is maximized by minimizing the moving time between the pickup position and placement position and reducing the recognition time to zero.
Added a new function maximizing the operational convenience of customers. |
Easy Component Registration New Part Editor
A Drag & Drop component registration system, allowing registration of component informatic recognition and rotation by simply clicking the mouse. (When applying Elite2) In addition, user convenience is further reinforced by unifying the on-line/off-line comvenience is further reinforced by unifying the on-line/off-line component registration systems. |
Mixed Use of Electric Feeder and Pneumatic Feeder
Mixed use of electric and pneumatic feeders in the same feeder base is available for SM series component placers. The investment in production can be minimized by using these feeders along with existing feeders. |
The highest applicability to long and large PCBs among machines of the same class |
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Features | ||
NO. | Performance | Parameter |
1 | Placement Speed | Chip 30,000CPH(Optimal) |
2 | Applicable Component | 0402~22(h12mm)(Flying) ~55(h15mm)(Stage) |
3 | Placement Accuracy | ±40μm@±3σ/Chip ±30μm@±3σ/QFP |
4 | Applicble PCB | L460×W400×1Lane (Standard) L1,200×W510×1Lane(Option) |
SM482 PLUS Specification: | |||
Model | SM482 PLUS | ||
Alignment | Flying Vision + Stage Vision | ||
Number of Spindles | 6 Spindes × 1 Gantry | ||
Placement Speed | 30,000CPH(Optimum) | ||
Placement Accuracy | Chip | ±40μm@μ±3σ | |
QFP | ±30μm@μ±3σ | ||
Component Range | Flying Vision | 0402(01005)~□14mm IC, Connector (Lead Pitch 0.4mm) BGA,CSP (Ball pitch 0.65mm) | |
0603(0201)~□22mm IC Connector(Lead pitch 0.5mm)~ 17mm BGA, CSP(Ball pitch 0.75mm) | |||
Stage Vision | ~32mm IC Connector(Lead Pitch 0.5mm)~55mm(MFOV) | ||
~42mm IC,Connector(Lead Pitch 0.4mm) BGA,CSP(Ball pitch 1.0mm)~55mm(MFOV)~75mm Connector | |||
Max.Height | 15mm | ||
| Min. | 50(L)×40(W) | |
Max. | Single Lane | 460(L)×400(W) 510(L)×460(W)Option 610(L)×510(W)Option Max. 1,200(L)×510(W) Option | |
Dual Lane | NA | ||
PCB Thickness | 0.38~4.2 | ||
Feeder Capacity (8mm standard) | 120ea/112ea(Dacking Cart) | ||
Utility | Power | AC200/208/220/240/380/415V(50/60Hz, 3Phase) | |
Max3.5kVA | |||
Air Consumption | 180Ne/min | ||
50Ne/min (vacuum pump) | |||
Mass(kg) | Approx.1600 | ||
External Dimension (mm) | 1650(L)×1680(D)×1530(H) |
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