As a high precision multi-functional component placer equipped with a high precision force control head based on the SM421 platform, the SM451 applies linear scale to the X-Y axes to improve the placement accuracy. Basically, the machine handles components from 0402 microchips, bare chips and PiP insert components. In addition, the machine can place special componnts by handling components with heights of up to 28mm ad well ae POP and providing a gripper nozzle, lift-off check, rear side reflection recognition, etc.
In order to reinforce its capacity to handle odd-shaped components. The gripper nozzle, component lead lift-off (warp) check using a laser sensor, rear sensor and Pin recognition function for PiP placement are added.
High Precision Force Control
Allows precision placement of PiP insert components, flip chips, etc, by applying the Z axis force control system controlling the force widely from 0.1N to 50N.
Panorama View Function
Since large-sized components are not viewed in one screen, it is hard to adjust their pickup or placement positions. In order to remove such inconvenience, the panorama view function is added to allow large components to be viewed within the FOV of a camera.
Component Monitoring before/after Plancement
Checks for nozzle contamination during production to prevent non-insertion and dumping of a large number of components in advance, ensuring high quality production. Time of inspection-Before/after ANC; before/after component placement; and after component dumping
Multi-Vendor Component Management Function
When the same components are supplied from different component supply devices, this function allows components to be use without changing a PCB file and downloading a new PCB file.
On-the-fly Placement Method
Owing to techwin's own On-the-fly image recognition technology which allows component recognition without stopping while moving after component pickup, placement speed is maximized by minimizing the moving time between the pickup position and placement position and reducing the recognition time to zero.
Added a new function maximizing the operational convenience of customers.
Easy Component Registration New Part Editor
A Drag & Drop component registration system, allowing registration of component informatic recognition and rotation by simply clicking the mouse. (When applying Elite2) In addition, user convenience is further reinforced by unifying the on-line/off-line comvenience is further reinforced by unifying the on-line/off-line component registration systems.
Mixed Use of Electric Feeder and Pneumatic Feeder
Mixed use of electric and pneumatic feeders in the same feeder base is available for SM series component placers. The investment in production can be minimized by using these feeders along with existing feeders.
The highest applicability to long and large PCBs among machines of the same class
SM451 Features:
1
Placement Speed
Chip 8,500CPH(IPC9850)
QFP 4,000CPH(IPC9850)
2
Applicable Component
0402~Max. 57×42mm(h28mm)
3
Placement Accuracy
±50μm@±3σ/Chip
±25μm@±3σ/QFP
4
Applicable PCB
L460×W420×1Lane (Standard)
L610×W460×1Lane(Option)
SM451 Specification:
Model
SM451
Alignment
Stage Vision
Number of Spindles
4 Spindes × 1 Gantry
Placement Speed
Chip 1608 8,500 CPH (IPC9850)
SOP 7,000 CPH (IPC9850)
QFP 4,000 CPH (IPC9850)
Placement Accuracy
Chip
±50μm@μ±3σ
QFP
±25μm@μ±3σ
Component Range
Flying Vision
0402~22mm IC(Fix Type) (Option:0402)
Stage Vision
~43×32mm IC (Lead Pitch 0.3mm~□55mm (MFOV)
~57×42mm IC (Lead Pitch 0.4mm~□55mm (MFOV)~100mm Connector
Max.Height
28mm
Min.
50(L)×40(W)
Max.
Single Lane
460(L)×420(W)
510(L)×420(W)
610(L)×460(W)
Dual Lane
NA
PCB Thickness
0.38~4.2
Feeder Capacity (8mm standard)
60ea/56ea(Dacking Cart)
Option: 120ea/112ea(Dacking Cart)
Utility
Power
AC200/208/220/240/380/415V(50/60Hz, 3Phase)
Max.4.7kVA
Air Consumption
0.5~0.7MPa(5.0~7.0kgf/cm²)
220Ne/min
50Ne/min (vacuum pump)
Mass(kg)
Approx.1820
External Dimension (mm)
1650(L)×1680(D)×1485(H)
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